Leverage Our Manufacturing Expertise

KCB has the necessary resources in place to manage procurement, handling, storage and delivery of product. KCB is also uniquely positioned to support the full range of DC and RF testing necessary to ensure that every device is 100 percent compliant to your specifications.

Device Manufacturing

  • Microelectronics Assembly
  • Eutectic bonding
  • Epoxy die bonding
  • Wedge and ball bonding
  • Wire bonding
  • Visual/bond pull inspection
  • Pre-seal vacuum bake
  • Hermetic solder seal
  • Hermetic seam seal
  • Non-hermetic epoxy seal
  • Ink or engrave marking
  • Package lead forming

Device Evaluation/Qualification

  •  Product Realization
  • Element Evaluation
  • Wafer Lot Acceptance

Device Testing/Screening

  • Small Signal RF (DC to 40 GHz)
  • Large Signal RF (DC to 40 GHz)
  • DC Parameters
  • Custom ATE Development
  • MIL-STD 750
  • MIL-STD 883
  • MIL-STD 19500
  • MIL-PRF 38534
  • MIL-PRF 38535

Workmanship Standards

NASA-EEE-INST-002 EEE Parts Selection, Screening, Qualification, and Derating
Mil-PRF-38535 Performance specification for integrated circuit (microelectronic) manufacturing
Mil-PRF-38534 Performance specification for Hybrid Microelectronics
Mil-STD-19500 General performance requirements for semiconductor devices

Test Methods

Mil-STD-883 Test methods, controls and procedures for testing microelectronic devices
Mil-STD-750 Testing for semiconductor devices

View Our Product Catalog for Hi-Rel RF/Microwave Semiconductors