MANUFACTURING

Process Capability

Component Attach

• Eutectic solder attach
• Epoxy attach
  

Wire Bonding

• Wedge Bonding
  
• Ball Bonding

Lid Seal

• Hermetic
  - Solder Seal
  - Resistance Weld

Final Prep

• Device Marking
  
• Package lead trim and forming
  
• Solder tinning