RF Manufacturing Solutions


Bypass our design team and head straight into production and test.

When your circuits are past the design stage and are ready to be put into production and test, KCB can leverage the same comprehensive suite of capabilities we use to realize our own product lines to manufacture, rf test, and screen your products. We have the necessary resources in place to manage procurement, handling, storage and delivery of product. KCB is also uniquely positioned to support the full range of DC and RF testing necessary to ensure that every device is 100 percent compliant to your specifications. Contact us today about your electronic manufacturing services needs.

Device Manufacturing

  • Microelectronics Assembly
  • Eutectic bonding
  • Epoxy die bonding
  • Wedge and ball bonding
  • Wire bonding
  • Visual/bond pull inspection
  • Pre-seal vacuum bake
  • Hermetic solder seal
  • Hermetic seam seal
  • Non-hermetic epoxy seal
  • Ink or engrave marking
  • Package lead forming

Device Testing/Screening

  • Small Signal RF (DC to 40 GHz)
  • Large Signal RF (DC to 40 GHz)
  • DC Parameters
  • Custom ATE Development
  • MIL-STD 750
  • MIL-STD 883
  • MIL-STD 19500
  • MIL-PRF 38534
  • MIL-PRF 38535

Device Evaluation/Qualification

  • Product Realization
  • Element Evaluation
  • Wafer Lot Acceptance

To learn about our Product Realization process, please contact us.